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2010 Beijing International Packaging Fair

时间:2010-07-08 09:43:00  来源:  作者:  浏览量:0

On June 2nd to 4th, “2010 Beijing International Packaging Fair (CHIPF)” first held by the China packaging federation was opening in Beijing•China international exhibition center. In the nearly 200 square meters booth, Sinovan showed “Move-Type Full Servo High Precision Corrugated Board Seven Color Printer & Die-cutter”. This is our equipment successfully display in the north area for first time, which laid a good foundation of the market for us to overall develop the north area.